Products & Services > Semiconductor Equipment
WAFER PROCESSING RELATED EQUIPMENT
- Infrared examination
- Litographic exposure
- Measuring double sided wafer patterns
- Process with UV
- Measuring Depth and Height
- Measuring of Thickness
- Unique Zoom Microscopes
- Infrared examination
Dimic infrared zoom
| Visible Light | Infrared Light | Infrared Light | Infrared Light |
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- Litographic exposure
Dimic double sided mask aligner. PEM series (for 4", 6" & 8")
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- Measuring double sided wafer patterns
Dimic double View. DCM series (4" & 6")
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upper image |
lower image |
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composite |
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- Process with UV
Objective for Laser Repair system
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Usable 3 wavelength for repair Broadband wavelength for observation |
- Measuring Depth and Height
Dimic Topography
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Non-Contact Depth and Height Measuring Microscope Hisomet II 
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- Measuring of Thickness
Dimic non contact Thickness measuring
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Non-Contact Thickness Measuring Microscope THS series (for 4", 6" & 8")  |
Unique Zoom Microscopes
- Dimic Ulta Zoom
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 Positioning of Ultra Long working distance zoom microscope on top of see through glass of vacuum chamber |
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- Dimic Topography